JK

Jae Dong Kim

AT Amkor Technology: 1 patents #28 of 84Top 35%
📍 Jicheon-myeon, AZ: #1 of 1 inventorsTop 100%
Overall (2003): #203,421 of 273,478Top 75%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6642610 Wire bonding method and semiconductor package manufactured using the same Young-Kuk Park, Byung Joon Han 2003-11-04