Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6596212 | Method and apparatus for increasing thickness of molded body on semiconductor package | Jonathon G. Greenwood | 2003-07-22 |
| 6534338 | Method for molding semiconductor package having a ceramic substrate | Ronald James Schoonejongen, Frank J. Juskey | 2003-03-18 |