Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6593545 | Laser defined pads for flip chip on leadframe package fabrication method | Jonathon G. Greenwood | 2003-07-15 |
| 6577012 | Laser defined pads for flip chip on leadframe package | Jonathon G. Greenwood | 2003-06-10 |
| 6546620 | Flip chip integrated circuit and passive chip component package fabrication method | Christopher M. Scanlan, Pat O'Brien | 2003-04-15 |
| 6534338 | Method for molding semiconductor package having a ceramic substrate | Ronald James Schoonejongen, Anthony James LoBianco | 2003-03-18 |
| 6507102 | Printed circuit board with integral heat sink for semiconductor package | John R. McMillan, Ronald Patrick Huemoeller | 2003-01-14 |