Issued Patents 2003
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6645858 | Method of catalyzing copper deposition in a damascene structure by plasma treating the barrier layer and then applying a catalyst such as iodine or iodine compounds to the barrier layer | Si Bum Kim | 2003-11-11 |
| 6627523 | Method of forming a metal wiring in a semiconductor device | — | 2003-09-30 |
| 6617238 | Method of manufacturing a metal wiring in a semiconductor device | — | 2003-09-09 |
| 6593236 | Method of forming a metal wiring in a semiconductor device with copper seed | — | 2003-07-15 |
| 6551932 | Method for forming metal line in a semiconductor device | — | 2003-04-22 |
| 6528415 | Method of forming a metal line in a semiconductor device | — | 2003-03-04 |