Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6645862 | Double-side polishing process with reduced scratch rate and device for carrying out the process | Guido Wenski, Johann Glas, Gerhard Heier | 2003-11-11 |
| 6583050 | Semiconductor wafer with improved flatness, and process for producing the semiconductor wafer | Guido Wenski, Ernst Feuchtinger, Willibald Bernwinkler, Wolfgang Winkler, Gerhard Heier | 2003-06-24 |
| 6514424 | Process for the double-side polishing of semiconductor wafers and carrier for carrying out the process | Guido Wenski, Gerhard Heier, Wolfgang Winkler | 2003-02-04 |