Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6600232 | Flip-chip semiconductor package structure and process for fabricating the same | Shih-Kuang Chiu | 2003-07-29 |
| 6573610 | Substrate of semiconductor package for flip chip package | — | 2003-06-03 |