Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6600232 | Flip-chip semiconductor package structure and process for fabricating the same | Ying-Chou Tsai | 2003-07-29 |
| 6506626 | Semiconductor package structure with heat-dissipation stiffener and method of fabricating the same | — | 2003-01-14 |