Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6653574 | Multi-layered substrate with a built-in capacitor design and a method of making the same | Chung-Ju Wu, Wei-Feng Lin | 2003-11-25 |
| 6524942 | Bond pad structure and its method of fabricating | Chung-Ju Wu, Wei-Feng Lin | 2003-02-25 |
| 6509646 | Apparatus for reducing an electrical noise inside a ball grid array package | Wei-Feng Lin, Chung-Ju Wu | 2003-01-21 |