Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6670692 | Semiconductor chip with partially embedded decoupling capacitors | Ching-Chang Shih, Chun-An Tu, Tsung-Chi Hsu, Ming-Huan Lu | 2003-12-30 |
| 6653574 | Multi-layered substrate with a built-in capacitor design and a method of making the same | Chen-Wen Tsai, Chung-Ju Wu | 2003-11-25 |
| 6524942 | Bond pad structure and its method of fabricating | Chen-Wen Tsai, Chung-Ju Wu | 2003-02-25 |
| 6509646 | Apparatus for reducing an electrical noise inside a ball grid array package | Chung-Ju Wu, Chen-Wen Tsai | 2003-01-21 |