Issued Patents 2003
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6645632 | Film-type adhesive for electronic components, and electronic components bonded therewith | Tsuyoshi Honda, Nobuhiro Ichiroku | 2003-11-11 |
| 6630745 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Shoichi Osada, Eiichi Asano, Shigeki Ino, Takayuki Aoki, Kazutoshi Tomiyoshi | 2003-10-07 |
| 6627328 | Light-transmissive epoxy resin composition and semiconductor device | Tatsuya Kanamaru, Tsuyoshi Honda, Eiichi Asano | 2003-09-30 |
| 6569532 | Epoxy resin compositions and premolded semiconductor packages | Kazutoshi Tomiyoshi, Kazuhiro Arai, Koki Oitori, Hironori Sakamoto, Yuji Kishigami +2 more | 2003-05-27 |
| 6558812 | Liquid epoxy resin composition and semiconductor device | Kazuaki Sumita | 2003-05-06 |
| 6534193 | Liquid epoxy resin composition and semiconductor device | Kazuaki Sumita | 2003-03-18 |
| 6518332 | Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith | Eiichi Asano, Kazutoshi Tomiyoshi, Masachika Yoshino, Shoichi Osada | 2003-02-11 |
| 6512031 | Epoxy resin composition, laminate film using the same, and semiconductor device | Tsuyoshi Honda, Miyuki Wakao | 2003-01-28 |
| 6506822 | Epoxy resin composition | Nobuhiro Ichiroku, Miyuki Wakao | 2003-01-14 |