Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6630745 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Shoichi Osada, Eiichi Asano, Shigeki Ino, Takayuki Aoki, Toshio Shiobara | 2003-10-07 |
| 6569532 | Epoxy resin compositions and premolded semiconductor packages | Kazuhiro Arai, Toshio Shiobara, Koki Oitori, Hironori Sakamoto, Yuji Kishigami +2 more | 2003-05-27 |
| 6518332 | Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith | Eiichi Asano, Masachika Yoshino, Toshio Shiobara, Shoichi Osada | 2003-02-11 |