Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6602782 | Methods for forming metal wiring layers and metal interconnects and metal interconnects formed thereby | Jong-Myeong Lee, Byung-Hee Kim, Gil-Heyun Choi | 2003-08-05 |
| 6586340 | Wafer processing apparatus and wafer processing method using the same | Jong-Myeong Lee, Byung-Hee Kim, Ju-Young Yun, Gil-Heyun Choi | 2003-07-01 |
| 6573147 | Method of forming a semiconductor device having contact using crack-protecting layer | Kwang-Jin Moon, Hee-Sook Park | 2003-06-03 |