Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6602782 | Methods for forming metal wiring layers and metal interconnects and metal interconnects formed thereby | Myoung-Bum Lee, Jong-Myeong Lee, Byung-Hee Kim | 2003-08-05 |
| 6590251 | Semiconductor devices having metal layers as barrier layers on upper or lower electrodes of capacitors | Sang-Bom Kang, Hyun-Seok Lim, Yung-sook Chae, In-Sang Jeon | 2003-07-08 |
| 6586340 | Wafer processing apparatus and wafer processing method using the same | Jong-Myeong Lee, Byung-Hee Kim, Myoung-Bum Lee, Ju-Young Yun | 2003-07-01 |