Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6662442 | Process for manufacturing printed wiring board using metal plating techniques | Kouji Matsui, Hirofumi Fujii, Satoshi Tanigawa | 2003-12-16 |
| 6538209 | Substrate for mounting semiconductor element having circuit patterns, and an insulating layer made of photosensitive and thermally-melting type adhesive resin | Kazuo Ouchi | 2003-03-25 |