Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6662442 | Process for manufacturing printed wiring board using metal plating techniques | Kouji Matsui, Kazunori Mune, Satoshi Tanigawa | 2003-12-16 |
| 6623843 | Resin composition for wiring circuit board, substrate for wiring circuit board, and wiring circuit board | Shunichi Hayashi | 2003-09-23 |
| 6591491 | Method for producing multilayer circuit board | Satoshi Tanigawa | 2003-07-15 |