Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6653740 | Vertical conduction flip-chip device with bump contacts on single surface | Aram Arzumanyan, Tim Sammon | 2003-11-25 |
| 6610574 | Process for forming MOSgated device with trench structure and remote contact | — | 2003-08-26 |
| 6608350 | High voltage vertical conduction superjunction semiconductor device | Srikant Sridevan | 2003-08-19 |
| 6593622 | Power mosfet with integrated drivers in a common package | Tim Sammon, Mark Pavier, Adam Amali | 2003-07-15 |
| 6512267 | Superjunction device with self compensated trench walls | Srikant Sridevan | 2003-01-28 |