Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6653740 | Vertical conduction flip-chip device with bump contacts on single surface | Daniel M. Kinzer, Aram Arzumanyan | 2003-11-25 |
| 6593622 | Power mosfet with integrated drivers in a common package | Daniel M. Kinzer, Mark Pavier, Adam Amali | 2003-07-15 |