Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6537854 | Method for bonding IC chips having multi-layered bumps with corrugated surfaces and devices formed | Shyh-Ming Chang, Chi Yuan Wu | 2003-03-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6537854 | Method for bonding IC chips having multi-layered bumps with corrugated surfaces and devices formed | Shyh-Ming Chang, Chi Yuan Wu | 2003-03-25 |