Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6605491 | Method for bonding IC chips to substrates with non-conductive adhesive | Yu-Te HSIEH, Wen-Ti Lin | 2003-08-12 |
| 6537854 | Method for bonding IC chips having multi-layered bumps with corrugated surfaces and devices formed | Jwo-Huei Jou, Chi Yuan Wu | 2003-03-25 |