HW

Huey-Ming Wang

MI Multiplanar Technologies Incorporated: 5 patents #2 of 7Top 30%
📍 Ballston Lake, NY: #3 of 45 inventorsTop 7%
🗺 New York: #362 of 9,423 inventorsTop 4%
Overall (2003): #9,789 of 273,478Top 4%
5
Patents 2003

Issued Patents 2003

Showing 1–5 of 5 patents

Patent #TitleCo-InventorsDate
6641461 Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal David A. Hansen, Gerard Moloney, Jiro Kajiwara 2003-11-04
6623343 System and method for CMP head having multi-pressure annular zone subcarrier material removal control Jiro Kajiwara, Gerard Moloney, David A. Hansen, Alejandro Reyes 2003-09-23
6558232 System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control Jiro Kajiwara, Gerard Moloney, David A. Hansen, Alejandro Reyes 2003-05-06
6540590 Chemical mechanical polishing apparatus and method having a rotating retaining ring Jiro Kajiwara 2003-04-01
6506105 System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control Jiro Kajiwara, Gerard Moloney, David A. Hansen, Alejandro Reyes 2003-01-14