Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6641461 | Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal | Huey-Ming Wang, David A. Hansen, Jiro Kajiwara | 2003-11-04 |
| 6623343 | System and method for CMP head having multi-pressure annular zone subcarrier material removal control | Jiro Kajiwara, Huey-Ming Wang, David A. Hansen, Alejandro Reyes | 2003-09-23 |
| 6558232 | System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control | Jiro Kajiwara, Huey-Ming Wang, David A. Hansen, Alejandro Reyes | 2003-05-06 |
| 6527625 | Chemical mechanical polishing apparatus and method having a soft backed polishing head | Jiro Kajiwara, David A. Hansen | 2003-03-04 |
| 6506105 | System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control | Jiro Kajiwara, Huey-Ming Wang, David A. Hansen, Alejandro Reyes | 2003-01-14 |