Issued Patents 2003
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6652364 | Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads | Scott Meikle | 2003-11-25 |
| 6652365 | Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads | Scott Meikle | 2003-11-25 |
| 6648736 | Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads | Scott Meikle | 2003-11-18 |
| 6638148 | Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads | Scott Meikle | 2003-10-28 |
| 6620032 | Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies | — | 2003-09-16 |
| 6616828 | Recovery method for platinum plating bath | — | 2003-09-09 |
| 6613671 | Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby | Fred Fishburn | 2003-09-02 |
| 6609957 | Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads | Scott Meikle | 2003-08-26 |
| 6602117 | Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods | Nishant Sinha | 2003-08-05 |
| 6579799 | Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates | Scott Meikle | 2003-06-17 |
| 6561878 | Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads | Scott Meikle | 2003-05-13 |
| 6551935 | Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods | Nishant Sinha | 2003-04-22 |
| 6548407 | Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates | Scott Meikle | 2003-04-15 |
| 6545357 | Metal nitride barrier layer and electroplating seed layer with the same metal as the metal nitride layer | — | 2003-04-08 |
| 6511912 | Method of forming a non-conformal layer over and exposing a trench | Kevin G. Donohoe, Cem Basceri | 2003-01-28 |