Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6518097 | Method for fabricating wafer-level flip chip package using pre-coated anisotropic conductive adhesive | Myung Jin Yim | 2003-02-11 |
KB
Kyung Wook Baik
Overall (2003): #174,838 of 273,478Top 65%
1
Patents 2003