Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6518097 | Method for fabricating wafer-level flip chip package using pre-coated anisotropic conductive adhesive | Kyung Wook Baik | 2003-02-11 |
| 6514560 | Method for manufacturing conductive adhesive for high frequency flip chip package applications | Kyung Wook Paik, Woon-Seong Kwon | 2003-02-04 |