TT

Toshitaka Tezuna

YA Yazaki: 1 patents #4 of 29Top 15%
📍 Novi, MI: #35 of 116 inventorsTop 35%
🗺 Michigan: #1,670 of 6,370 inventorsTop 30%
Overall (2003): #99,537 of 273,478Top 40%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6616463 Method and apparatus for solder splicing and grounding coaxial cables Jason T. Burnett, Michael C. Iannaccone 2003-09-09