Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6616463 | Method and apparatus for solder splicing and grounding coaxial cables | Jason T. Burnett, Toshitaka Tezuna | 2003-09-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6616463 | Method and apparatus for solder splicing and grounding coaxial cables | Jason T. Burnett, Toshitaka Tezuna | 2003-09-09 |