Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6667547 | High current capacity semiconductor device package and lead frame with large area connection posts and modified outline | Arthur Woodworth, Ken Teasdale | 2003-12-23 |
| 6512304 | Nickel-iron expansion contact for semiconductor die | — | 2003-01-28 |