Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6667547 | High current capacity semiconductor device package and lead frame with large area connection posts and modified outline | Peter R. Ewer, Ken Teasdale | 2003-12-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6667547 | High current capacity semiconductor device package and lead frame with large area connection posts and modified outline | Peter R. Ewer, Ken Teasdale | 2003-12-23 |