SO

Seng Hooi Ong

IN Intel: 1 patents #759 of 2,151Top 40%
📍 Simpang Ampat, MY: #1 of 1 inventorsTop 100%
Overall (2003): #122,050 of 273,478Top 45%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6664483 Electronic package with high density interconnect and associated methods Tee Onn Chong, Robert L. Sankman 2003-12-16