Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6664483 | Electronic package with high density interconnect and associated methods | Tee Onn Chong, Seng Hooi Ong | 2003-12-16 |
| 6632734 | Parallel plane substrate | — | 2003-10-14 |
| 6563210 | Parallel plane substrate | — | 2003-05-13 |
| 6555920 | Vertical electronic circuit package | Chee-Yee Chung, David G. Figueroa | 2003-04-29 |