Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6597575 | Electronic packages having good reliability comprising low modulus thermal interface materials | James C. Matayabas, Jr., Jinlin Wang | 2003-07-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6597575 | Electronic packages having good reliability comprising low modulus thermal interface materials | James C. Matayabas, Jr., Jinlin Wang | 2003-07-22 |