JW

Jinlin Wang

IN Intel: 1 patents #759 of 2,151Top 40%
📍 Beijing, AZ: #2 of 5 inventorsTop 40%
Overall (2003): #196,512 of 273,478Top 75%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6597575 Electronic packages having good reliability comprising low modulus thermal interface materials James C. Matayabas, Jr., Paul A. Koning 2003-07-22