Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6606425 | Transfer molded packages with embedded thermal insulation | Douglas E. Crafts, Kenzo Ishida, David J. Chapman, James F. Farrell, Suresh Ramalingam +1 more | 2003-08-12 |
| 6528345 | Process line for underfilling a controlled collapse | Suresh Ramalingam | 2003-03-04 |