Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6664511 | Package for optical components | Douglas E. Crafts, James F. Farrell, Mark Farrelly, Kenzo Ishida | 2003-12-16 |
| 6606425 | Transfer molded packages with embedded thermal insulation | Douglas E. Crafts, Kenzo Ishida, David J. Chapman, Duane Cook, James F. Farrell +1 more | 2003-08-12 |
| 6528345 | Process line for underfilling a controlled collapse | Duane Cook | 2003-03-04 |
| 6525922 | High performance via capacitor and method for manufacturing same | Paul Winer, Richard H. Livengood | 2003-02-25 |