Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6576550 | ‘Via first’ dual damascene process for copper metallization | Uwe Schroeder, Karen L. Holloway | 2003-06-10 |
| 6521542 | Method for forming dual damascene structure | Mike Armacost, Bruno Spuler, Alois Gutmann | 2003-02-18 |