NL

Ning-Cheng Lee

TA The Indium Corporation Of America: 1 patents #1 of 3Top 35%
📍 Utica, NY: #2 of 8 inventorsTop 25%
🗺 New York: #3,048 of 9,423 inventorsTop 35%
Overall (2003): #149,755 of 273,478Top 55%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6610559 Integrated void-free process for assembling a solder bumped chip Shanger Wang, Wushing Yin 2003-08-26