SW

Shanger Wang

TA The Indium Corporation Of America: 1 patents #1 of 3Top 35%
📍 San Diego, CA: #524 of 1,748 inventorsTop 30%
🗺 California: #8,996 of 28,521 inventorsTop 35%
Overall (2003): #118,389 of 273,478Top 45%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6610559 Integrated void-free process for assembling a solder bumped chip Wushing Yin, Ning-Cheng Lee 2003-08-26