Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6657313 | Dielectric interposer for chip to substrate soldering | Peter J. Brofman, Shaji Faroon, John U. Knickerbocker, Scott I. Langenthal, Kathleen A. Stalter | 2003-12-02 |
| 6574859 | Interconnection process for module assembly and rework | Shaji Farooq, Mario J. Interrante, William E. Sablinski | 2003-06-10 |
| 6559527 | Process for forming cone shaped solder for chip interconnection | Peter J. Brofman, Shaji Farooq, John U. Knickerbocker, Scott I. Langenthal, Kathleen A. Stalter | 2003-05-06 |
| 6548909 | Method of interconnecting electronic components using a plurality of conductive studs | Peter J. Brofman, Kathleen A. Stalter | 2003-04-15 |
| 6502999 | Opto-electronic transceiver module and hermetically sealed housing therefore | Mitchell S. Cohen, David Peter Gaio, William K. Hogan, Steven P. Ostrander, Jeannine M. Trewhella | 2003-01-07 |