Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6574859 | Interconnection process for module assembly and rework | Mario J. Interrante, Sudipta K. Ray, William E. Sablinski | 2003-06-10 |
| 6559527 | Process for forming cone shaped solder for chip interconnection | Peter J. Brofman, John U. Knickerbocker, Scott I. Langenthal, Sudipta K. Ray, Kathleen A. Stalter | 2003-05-06 |
| 6528145 | Polymer and ceramic composite electronic substrates | Daniel G. Berger, Lester W. Herron, James N. Humenik, John U. Knickerbocker, Robert W. Pasco +2 more | 2003-03-04 |