Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656773 | Transfer molding of integrated circuit packages | Marie-France Boyaud, Catherine Dufort, Marie-Claude Paquet | 2003-12-02 |
| 6547452 | Alignment systems for subassemblies of overmolded optoelectronic modules | Benson Chan, Paul F. Fortier, Francois Guindon, Glen Walden Johnson, Martial Letourneau +1 more | 2003-04-15 |
| 6508595 | Assembly of opto-electronic module with improved heat sink | Benson Chan, Paul F. Fortier, Ladd W. Freitag, Gary T. Galli, Francois Guindon +3 more | 2003-01-21 |