Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656773 | Transfer molding of integrated circuit packages | Marie-France Boyaud, Marie-Claude Paquet, Real Tetreault | 2003-12-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656773 | Transfer molding of integrated circuit packages | Marie-France Boyaud, Marie-Claude Paquet, Real Tetreault | 2003-12-02 |