EH

Eric B. Hultmark

IBM: 1 patents #1,943 of 5,539Top 40%
📍 Wappingers Falls, NY: #68 of 129 inventorsTop 55%
🗺 New York: #3,048 of 9,423 inventorsTop 35%
Overall (2003): #229,885 of 273,478Top 85%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6599774 Technique for underfilling stacked chips on a cavity MLC module Brian C. Noble 2003-07-29