BN

Brian C. Noble

IBM: 1 patents #1,943 of 5,539Top 40%
📍 Lagrangeville, NY: #15 of 31 inventorsTop 50%
🗺 New York: #3,048 of 9,423 inventorsTop 35%
Overall (2003): #254,553 of 273,478Top 95%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6599774 Technique for underfilling stacked chips on a cavity MLC module Eric B. Hultmark 2003-07-29