Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6607939 | Method of making a multi-layer interconnect | Simon J. S. McElrea, Brad Banister | 2003-08-19 |
| 6576839 | Bond-ply structure for interconnection of circuit layer pairs with conductive inks | Scott M. Zimmerman, Brad Banister | 2003-06-10 |
| 6570250 | Power conditioning substrate stiffener | — | 2003-05-27 |
| 6560844 | Alignment plate with matched thermal coefficient of expansion | — | 2003-05-13 |