Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6607939 | Method of making a multi-layer interconnect | Richard J. Pommer, Simon J. S. McElrea | 2003-08-19 |
| 6576839 | Bond-ply structure for interconnection of circuit layer pairs with conductive inks | Richard J. Pommer, Scott M. Zimmerman | 2003-06-10 |