Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6523446 | Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame | Yoshiyuki Tanabe, Yoshihiro Nomura, Hiroshi Kirihara, Youichi Hosokawa, Shinji Iioka | 2003-02-25 |