Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6621170 | Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film | Kazunori Yamamoto, Yasushi Shimada, Yasushi Kumashiro, Teiichi Inada, Hiroyuki Kuriya +5 more | 2003-09-16 |
| 6523446 | Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame | Yoshiyuki Tanabe, Yoshihiro Nomura, Youichi Hosokawa, Shinji Iioka, Satoru Yanagisawa | 2003-02-25 |