Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6670430 | Thermosetting resin compositions comprising epoxy resins, adhesion promoters, and curatives based on the combination of nitrogen compounds and transition metal complexes | — | 2003-12-30 |
| 6667194 | Method of bonding die chip with underfill fluxing composition | Lawrence N. Crane, J. Paul Krug, Andrew D. Messana, John G. Woods | 2003-12-23 |
| 6632893 | Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners | Zbigniew Andrew Szczepaniak | 2003-10-14 |
| 6617399 | Thermosetting resin compositions comprising epoxy resins, adhesion promoters, curatives based on the combination of nitrogen compounds and transition metal complexes, and polysulfide tougheners | — | 2003-09-09 |
| 6519968 | Shipping container for exothermic material | — | 2003-02-18 |