Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6667194 | Method of bonding die chip with underfill fluxing composition | Mark M. Konarski, J. Paul Krug, Andrew D. Messana, John G. Woods | 2003-12-23 |
| 6657031 | Reworkable thermosetting resin compositions | Christopher K. Ober, Young Cheol Bae, Shuyan Yu, Jong-Wook Park | 2003-12-02 |