Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6606425 | Transfer molded packages with embedded thermal insulation | Douglas E. Crafts, Kenzo Ishida, David J. Chapman, Duane Cook, James F. Farrell +1 more | 2003-08-12 |
| 6583388 | High thermal efficiency, small form-factor packages including thermally insulative cavities, and transfer molded variants | Douglas E. Crafts, David J. Chapman | 2003-06-24 |